The AW-GM270S/U is a IEEE 802.11b/g wireless module IC; it’s targeted to mobile devices including Digital Still Cameras (DSCs), Portable Media Players (PMPs), Personal Digital Assistants (PDAs), and Gaming Devices which need small footprint package, low power consumption, multiple interfaces and OS support. By using AW-GM270S/U, the customers can easily enable the Wi-Fi embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Compliance with the IEEE 802.11b/g standard, the AW-GM270S/U uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-GM270S/U. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption, the AW-GM270S/U also supports the IEEE 802.11i security standard through the implementation of AES-CCMP. The support of QoS also enables the AW-GM270S/U for the use of video, voice and multimedia applications.

The AW-GM270S/U provides host interfaces SDIO (GM270S) or USB (GM270U) which are suitable for multiple mobile processors for different applications. With the support of Bluetooth co-existence and cellular phone co-existence, the AW-GM270S/U is also the best solution for mobile phones and PDA phones applications.

AW-GM270S/U module adopts Realtek’s latest highly-integrated WLAN SoC---RTL8711S/U. All the other components are implemented by all means to reach the mechanical specification required.

AW-GM270S/U uses surface mount technologies (SMT) that solder join and soldering strength provide mounting mechanism to secure the AW-GM270S/U module against vibration and shock on the host system.