The AW-GH381 is a IEEE 802.11 b/g Wireless LAN & Bluetooth Module IC; it’s targeted to mobile devices including Mobile Phones, Digital Still Cameras (DSCs), Portable Media Players (PMPs), Personal Digital Assistants (PDAs), and Gaming Devices which need small footprint package, low power consumption, multiple interfaces and OS support. By using AW-GH381, the customers can easily enable the Wi-Fi and BT embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Compliance with the IEEE 802.11b/g standard, the AW-GH381 uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-GH381. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption, the AW-GH381 also supports the IEEE 802.11i security standard through the implementation of Advanced Encryption Standard (AES)/Counter Mode CBC-MAC Protocol (CCMP), and WEP with TKIP security mechanisms. The AW-GH381 also supports IPSec with DES/3DES/ASE encryption and MD5/SHA-1 authentication.

For the video, voice and multimedia applications the AW-GH381 support 802.11e Quality of Service (QoS).

For Bluetooth operation, the AW-GH381 is Bluetooth 2.0+Enhanced Data Rate (EDR) compliant. In addition, the AW-GH381 also supports Bluetooth 2.1 features.

The AW-GH381 supports SDIO and G-SPI for WLAN to the host processor. High speed UART,PCM/Inter-IC Sound(I²S), and SDIO interface are available to connect the BT core the host processor. AW-GH381 is suitable for multiple mobile processors for different applications. With the support cellular phone co-existence, the AW-GH381 is also the best solution for mobile phones and PDA phones applications.

AW-GH381 module adopts the leading-edge highly-integrated WLAN SoC. All the other components are implemented by all means to reach the mechanical specification required. AW-GH381 uses IC module integration package technology that provides customers mounting mechanism to secure the AW-GH381 module against vibration and shock on the host system. AW-GH381 uses module IC integration package technology can provide more reliable and strong electrical and mechanical performance.